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H&V’s ViaMat aramid paper is said to deliver improvements in dimensional stability.
April 7, 2009
By: DAVID SAVASTANO
Editor, Ink World Magazine
Hollingsworth & Vose has introduced ViaMat aramid paper, a new nonwoven organic reinforcement material for electronic packaging. The new ViaMat paper delivers improvements in dimensional stability and enables higher interconnect densities. “ViaMat paper fills the void created by the technical limitations of woven glass in advanced high-performance electronic packaging applications,” said Nate Burnes, business manager for advanced fiber nonwovens at H&V. For manufacturers of PCBs on...
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